Slide 003: Cutting vs. Engraving — Modes, Settings, and Output

Slide Visual

Slide Overview

This slide differentiates the two primary laser operation modes — vector cutting and raster engraving — and explains how power and speed settings control the interaction between the laser and material. Students will understand how to interpret and configure these settings for different materials and desired outcomes.

Instruction Notes

Vector Cutting

In vector mode, the laser follows defined paths — lines, curves, and shapes from vector artwork (SVG, DXF, AI formats). The laser fires continuously while the gantry traces the path.

Key settings: - Power: 60-100% for cutting through material - Speed: Slower = more energy per point = deeper cut. Typical: 5-30 mm/s for cutting - Passes: Multiple passes at lower power can produce cleaner cuts than a single high-power pass - Air assist: Always ON for cutting — clears debris and prevents flame

Cut quality indicators: - Clean cut: Slight taper (wider at top, narrower at bottom), minimal charring - Over-powered: Excessive charring, wide kerf, melted edges (plastics) - Under-powered: Incomplete cut — material still connected at bottom

Raster Engraving

In raster mode, the laser head scans back and forth in horizontal rows, modulating power to create images, text, and filled areas. Think of it like a printer that removes material instead of adding ink.

Key settings: - Power: 10-80% (lower for shallow engraving, higher for deep) - Speed: 100-500 mm/s (much faster than cutting) - DPI/Resolution: 300-1000 dots per inch (detail level) - Scan gap: Distance between raster lines (typically 0.1-0.05mm)

Engraving types: - Shallow marking: Low power, high speed — surface color change without significant material removal - Standard engraving: Medium power — removes 0.2-1mm of material - Deep engraving: High power, slow speed, multiple passes — removes 2-5mm for stamps, molds

Power and Speed Relationship

Goal	Power	Speed	Result
Light engraving	15-25%	300-500 mm/s	Surface mark, minimal depth
Medium engraving	30-50%	200-400 mm/s	0.3-1mm depth
Deep engraving	60-80%	100-200 mm/s	1-3mm depth
Thin cut (<3mm)	50-80%	15-30 mm/s	Clean through-cut
Thick cut (3-10mm)	80-100%	3-15 mm/s	Through-cut, more char
Score/mark line	10-20%	50-100 mm/s	Surface line, no material removal

Kerf Compensation

The laser beam removes material (kerf width typically 0.15-0.30mm). For parts that must fit together: - Male parts (plugs, tabs): Design 0.1-0.15mm larger per side - Female parts (slots, holes): Design 0.1-0.15mm larger per side - Most laser software includes an automatic kerf offset setting

Vector Engraving vs. Raster Engraving

• Vector engraving: Follows lines/paths, good for outlines and text. Fast for simple designs.
• Raster engraving: Scans in rows, good for filled areas, images, and gradients. Slower for large areas.
• Many jobs combine both: raster engrave the design, then vector cut the outline.

Key Talking Points

1. Vector cutting follows paths; raster engraving scans in rows — most jobs use both modes in combination
2. Power and speed are inversely related: to increase energy input, either raise power or lower speed
3. Kerf compensation is essential for parts that fit together — design tolerances must account for material removed by the beam

Learning Objectives (Concept Check)

• [ ] Students can distinguish between vector cutting and raster engraving and describe when each is used
• [ ] Students can explain the relationship between power, speed, and energy delivered to the material
• [ ] Students can apply kerf compensation principles to a design requiring fitted parts

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Last Updated: 2026-03-19